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PRODUCT CENTER

FRONT SILVER PASTE
FRONT SILVER PASTEPOSITION: >>PRODUCT >>FRONT SILVER PASTE

DKEM's newest front silver paste, L020h20k, is designed for P/N+ crystalline silicon solar cells passivated by SiNx with thickness between 75 to 90nm. It can form low ohmic contact to wafers from 60 to 120 /sq.


L020h20k has great paste rheology. This screen printable paste is suitable for past printing, preferably >200mm/s.  It has unique organic system, which yields fingers with high aspect ratio and flat tops.


When fired properly, L020h20k yields very high bulk conductivity and low contact resistivity,which results in very high fill factor and conversion efficiency.


Thanks to the carefully designed glass chemistry and special additives in the formulation, L020h20k can form very low contact resistivity when etching SiNx and reacting with Si during the firing process, and yield strong adhesion to silicon wafers. 


The reaction window between the silver paste and Si wafer is carefully engineered and controlled through the paste chemistry, therefore, L020h20k is be able to make good contact to a wide range of emitter profile, including shallow emitters.


L020h20k is compatible with industry-mostly-used back silver pastes, as well as back aluminum pastes.





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